JPH0160949B2 - - Google Patents
Info
- Publication number
- JPH0160949B2 JPH0160949B2 JP22264383A JP22264383A JPH0160949B2 JP H0160949 B2 JPH0160949 B2 JP H0160949B2 JP 22264383 A JP22264383 A JP 22264383A JP 22264383 A JP22264383 A JP 22264383A JP H0160949 B2 JPH0160949 B2 JP H0160949B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- package
- ground
- internal
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000012212 insulator Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22264383A JPS60113451A (ja) | 1983-11-24 | 1983-11-24 | 半導体パツケ−ジ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22264383A JPS60113451A (ja) | 1983-11-24 | 1983-11-24 | 半導体パツケ−ジ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60113451A JPS60113451A (ja) | 1985-06-19 |
| JPH0160949B2 true JPH0160949B2 (en]) | 1989-12-26 |
Family
ID=16785663
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22264383A Granted JPS60113451A (ja) | 1983-11-24 | 1983-11-24 | 半導体パツケ−ジ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60113451A (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7172617B2 (ja) * | 2019-01-11 | 2022-11-16 | 株式会社デンソー | 電子装置およびその製造方法 |
-
1983
- 1983-11-24 JP JP22264383A patent/JPS60113451A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60113451A (ja) | 1985-06-19 |
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